TE Connectivity MICTOR Series Vertical Board PCB Header, 80 Contact(s), 0.8 mm Pitch, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 plateau de 20 unités)*

220,01 €

(TVA exclue)

266,21 €

(TVA incluse)

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  • Prêt à être expédié à partir du 18 mai 2026
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1 +220,01 €11,001 €

*Prix donné à titre indicatif

N° de stock RS:
469-577
Numéro d'article Distrelec:
304-53-690
Référence fabricant:
1658013-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

MICTOR

Pitch

0.8mm

Current

9.5A

Housing Material

Liquid Crystal Polymer

Number of Contacts

80

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Row Pitch

0.8mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94 V-0

Voltage

125V

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is engineered for vertical board-to-board applications, boasting an impressive 80 positions with a 0.8 mm centreline for optimal space utilisation. Designed with robust reliability in mind, this component is perfect for both power and signal transmission, ensuring seamless connectivity across your electronic systems. Crafted from high-quality materials, the header features a durable black Housing material that withstands demanding operating temperatures. With its surface mount capability and gold plating, this connector not only exhibits outstanding conductivity but also ensures longevity in various environmental conditions. The thoughtful design incorporates features like parallel board-to-board configuration and a secure mating retention mechanism, making it an ideal choice for modern PCBs that require dependable connections in compact settings.

Supports high-speed connections for enhanced data transmission

Designed for maximum compatibility with various PCB layouts

Offers reliable performance in extreme temperature ranges

Utilises gold plating for superior conductivity and corrosion resistance

Facilitates straightforward assembly with its surface mount technology

Incorporates locating posts for precise alignment during installation

Features an innovative design for efficient signal integrity and reduced crosstalk

Ensures a secure fit with effective mating retention features

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