TE Connectivity MICTOR Series Vertical Board PCB Header, 40 Contact(s), 0.8 mm Pitch

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Sous-total (1 plateau de 20 unités)*

250,15 €

(TVA exclue)

302,68 €

(TVA incluse)

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  • Expédition à partir du 08 juin 2026
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Prix par unité*
1 +250,15 €12,508 €

*Prix donné à titre indicatif

N° de stock RS:
480-795
Numéro d'article Distrelec:
304-64-534
Référence fabricant:
1658014-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

MICTOR

Product Type

PCB Header

Pitch

0.8mm

Current

9.5A

Number of Contacts

40

Housing Material

Liquid Crystal Polymer

Orientation

Vertical

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

0.8mm

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

125 V

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is an innovative solution designed for vertical board-to-board connectivity. With a robust architecture suited for both power and signal applications, this connector accommodates 40 positions with an impressive 0.8 mm centreline, ensuring reliability and performance. Crafted from high-quality materials, it features gold plating for optimal conductivity, while its compact design allows for efficient use of space on printed circuit boards. Engineered to withstand temperatures ranging from -65 to 125 °C, this header is ideal for diverse environmental conditions. Its easy surface mounting capability simplifies assembly, making it a preferred choice for industry professionals looking for dependable interconnection solutions.

Supports a fully loaded configuration for enhanced functionality

Utilises advanced materials for superior durability and longevity

Easy integration into existing systems due to its compact design

Offers excellent insulation resistance for improved safety

Specifically designed for parallel board-to-board configurations

Empowers engineers with streamlined assembly processes

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