TE Connectivity MICTOR Series Vertical Board PCB Header, 160 Contact(s), 0.8 mm Pitch

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Sous-total (1 plateau de 9 unités)*

215,67 €

(TVA exclue)

260,96 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Prix par unité*
1 +215,67 €23,963 €

*Prix donné à titre indicatif

N° de stock RS:
474-602
Référence fabricant:
2-1658013-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

MICTOR

Product Type

PCB Header

Pitch

0.8mm

Current

9.5A

Housing Material

Liquid Crystal Polymer

Number of Contacts

160

Orientation

Vertical

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

0.8mm

Termination Type

Surface Mount

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

125 V

Distrelec Product Id

304-63-954

Pays d'origine :
CN
The TE Connectivity PCB mount header is designed for seamless board-to-board connectivity, ensuring efficient signal and power transmission in compact applications. Its vertical orientation saves valuable space while accommodating up to 160 positions, ideal for high-density PCB configurations. Engineered with premium materials, it features gold plating for enhanced conductivity and corrosion resistance. The product is adept at withstanding rigorous operating environments with a temperature range of -65 to 125 °C, making it suitable for various industrial applications. With a low profile and careful design, this header is also compliant with several important regulatory standards, ensuring dependable performance across a range of applications.

Offers high-density interconnections with 160 positions

Constructed from robust polyimide film for durability

Compatible with surface mount technology for easy assembly

Provides excellent electrical performance with low impedance

Incorporates locating posts for precise PCB alignment

Designed for reflow solder capability up to 260°C

Features low halogen content for improved environmental compliance

Maintains consistent performance under extreme temperature fluctuations

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