Vishay Si2325DS Type P-Channel MOSFET, -530 mA, -150 V Enhancement, 3-Pin SOT-23

Sous-total (1 bobine de 3000 unités)*

1 236,00 €

(TVA exclue)

1 497,00 €

(TVA incluse)

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  • Expédition à partir du 21 septembre 2026
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la bobine*
3000 +0,412 €1 236,00 €

*Prix donné à titre indicatif

N° de stock RS:
919-0275
Référence fabricant:
SI2325DS-T1-E3
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

-530mA

Maximum Drain Source Voltage Vds

-150V

Series

Si2325DS

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

1.2Ω

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Forward Voltage Vf

-1.2V

Maximum Power Dissipation Pd

750mW

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

7.7nC

Maximum Operating Temperature

150°C

Width

1.4mm

Length

3.04mm

Standards/Approvals

RoHS

Height

1.02mm

Automotive Standard

No

Pays d'origine :
CN

Vishay Si2325DS Series MOSFET, -150V Maximum Drain Source Voltage, 1.2Ω Maximum Drain Source Resistance - SI2325DS-T1-E3


This p-channel MOSFET is a surface-mount semiconductor device designed for high-voltage switching and control in Compact assemblies. It functions as an enhancement-mode transistor suitable for use where reverse-polarity or high-side switching is required, and is optimised for low-power dissipation in small form-factor SOT-23 packages. The device operates across a wide temperature range, making it appropriate for varied industrial electronic contexts.

Features and Benefits:


• Maximum drain-source voltage supports 150V applications • Drain-source resistance of 1.2Ω reduces conduction losses • Continuous drain current of -530mA permits modest load driving • Typical gate charge of 7.7nC enables Faster gate transitions • Power dissipation rating of 750mW limits thermal build-up • Gate-source voltage tolerance of 20V allows robust drive margins

Applications


• Suitable for high-voltage load switching in automation systems • Ideal for high-side switching in control and power modules • Used for reverse-polarity protection in electronic designs • Can be used for level-shifted gate-drive circuits • Suitable for Compact power-management boards in instrumentation

What are the thermal limits for reliable operation?


The device is specified to operate between -55°C and 150°C, allowing use across typical industrial temperature ranges.

How does the package influence board layout?


The SOT-23 surface-mount package with three pins and Compact footprint supports dense assembly and straightforward thermal via placement for heat management.

What electrical constraint should designers observe for gate driving?


Designers must restrict gate-source voltage within ±20V to avoid gate dielectric stress and ensure long-term reliability.

How should power dissipation considerations affect cooling strategy?


With a 750mW dissipation rating, designers should provide adequate copper area or heatsinking on the PCB to maintain junction temperatures under load.

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