Infineon HEXFET Type N-Channel MOSFET, 20 A, 30 V Enhancement, 8-Pin SOIC IRF7832TRPBF

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Sous-total (1 paquet de 10 unités)*

9,82 €

(TVA exclue)

11,88 €

(TVA incluse)

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Temporairement en rupture de stock
  • 1 550 unité(s) expédiée(s) à partir du 14 août 2026
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Unité
Prix par unité
le paquet*
10 - 400,982 €9,82 €
50 - 900,766 €7,66 €
100 - 2400,716 €7,16 €
250 - 4900,667 €6,67 €
500 +0,539 €5,39 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
827-3896
Référence fabricant:
IRF7832TRPBF
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

20A

Maximum Drain Source Voltage Vds

30V

Package Type

SOIC

Series

HEXFET

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

4.8mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

34nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1V

Maximum Power Dissipation Pd

2.5W

Maximum Operating Temperature

155°C

Height

1.5mm

Standards/Approvals

No

Length

5mm

Automotive Standard

No

Infineon HEXFET Series MOSFET, 30V Maximum Drain Source Voltage, 20A Maximum Continuous Drain Current - IRF7832TRPBF


This MOSFET is a surface-mount N-channel enhancement device designed for power switching and control in compact electronic systems. It operates across a wide temperature range suitable for industrial environments and integrates into standard SOIC footprints for PCB assembly, offering a balance of current capability and manageable power dissipation for medium-power designs.

Features and Benefits:


• Very low on-resistance 4.8 mΩ enabling reduced conduction losses
• 20A continuous drain current supporting high-current loads
• 30V drain-source rating for common low-voltage power rails
• 34 nC typical gate charge for faster switching transitions
• 2.5W maximum power dissipation for sustained thermal handling
• ±20V gate-source tolerance allowing flexible drive levels

Applications


• Suitable for DC-DC converter switching stages
• Ideal for motor driver power switches in compact designs
• Used with synchronous rectification in power supplies
• Can be used for load switching in telecoms equipment
• Appropriate for battery management and power distribution

What thermal extremes can it withstand in service?


The device is specified to function between -55 °C and 155 °C, enabling use in harsh industrial temperature conditions.

How many pins does the package present for PCB layout?


It comes in an 8-pin SOIC package which aids in standard footprint placement and thermal spreading.

What gate drive considerations arise from its gate charge?


With a typical gate charge of 34 nC, drivers must supply sufficient peak current to achieve the desired switching speed without excessive drive losses.

How does its forward voltage affect series conduction scenarios?


The measured forward voltage of 1V affects the drop across intrinsic diode events and should be considered when designing for reverse recovery or body-diode conduction.

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