Infineon SIPMOS Type N-Channel MOSFET, 1.7 A, 100 V Enhancement, 4-Pin SOT-223

Sous-total (1 bobine de 1000 unités)*

271,00 €

(TVA exclue)

328,00 €

(TVA incluse)

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1000 +0,271 €271,00 €

*Prix donné à titre indicatif

N° de stock RS:
165-7514
Référence fabricant:
BSP373NH6327XTSA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

1.7A

Maximum Drain Source Voltage Vds

100V

Package Type

SOT-223

Series

SIPMOS

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

300mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

6.2nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

0.82V

Maximum Power Dissipation Pd

1.8W

Maximum Operating Temperature

150°C

Standards/Approvals

No

Height

1.6mm

Length

6.5mm

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 100V Maximum Drain Source Voltage, 1.7A Maximum Continuous Drain Current - BSP373NH6327XTSA1


This MOSFET is a compact N-channel enhancement transistor designed for surface-mount power switching and control in demanding environments. It operates across a wide temperature range and handles moderate continuous current and voltage levels, making it suitable for electronic systems requiring a rugged, automotive-capable switching element.

Features and Benefits:


• 100V drain-source rating enables high-voltage switching applications
• 300mΩ Rds(on) reduces conduction losses at rated current
• 1.7A continuous drain current supports steady-state loads
• 6.2nC typical gate charge allows efficient switching control
• 1.8W maximum power dissipation manages thermal stress in use
• 20V maximum gate-source voltage allows flexible gate drive levels

Applications


• Suitable for power management in automotive electronic modules
• Ideal for DC/DC converters in constrained assemblies
• Used with motor drivers for low-power actuator control
• Can be used for load switching in telematics units
• Used for battery management in auxiliary vehicle systems

What package is used for compact board-level mounting?


It is provided in a SOT-223 package designed for surface-mount assembly to save PCB space while allowing heat transfer through the tab.

How does it perform in high-temperature environments?


It is specified to operate from -55°C up to 150°C, allowing use in elevated ambient or engine-bay conditions.

What pin count and mounting style should designers expect?


The device uses four pins and is intended for direct surface mounting to a PCB for mechanical and electrical connection.

Is this device suitable for automotive qualification requirements?


It meets automotive-grade AEC-Q101 standards for semiconductor devices, aligning with vehicle electronic reliability specifications.

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