Infineon IGT65 Type N-Channel MOSFET, 70 A, 650 V Enhancement, 8-Pin PG-HSOF-8 IGT65R025D2ATMA1

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11,78 €

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14,25 €

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  • Plus 1 945 unité(s) expédiée(s) à partir du 10 août 2026
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1 - 911,78 €
10 - 9910,60 €
100 +9,78 €

*Prix donné à titre indicatif

N° de stock RS:
351-969
Référence fabricant:
IGT65R025D2ATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

70A

Maximum Drain Source Voltage Vds

650V

Series

IGT65

Package Type

PG-HSOF-8

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.03Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

11nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

236W

Maximum Operating Temperature

150°C

Standards/Approvals

JEDEC for Industrial Applications

Automotive Standard

No

Pays d'origine :
MY

Infineon IGT65 Series MOSFET, 650V Drain Source Voltage, 70A Continuous Drain Current - IGT65R025D2ATMA1


This MOSFET is a high-voltage switching transistor designed for demanding industrial environments. It operates across an extended temperature range and is supplied in a surface-mount package suited to compact boards. The device is intended for power conversion and switching roles where high voltage tolerance and robust continuous current handling are required.

Features and Benefits:


• 650V drain withstand for high-voltage switching applications
• 70A continuous drain capability for sustained load handling
• 0.03Ω Rds(on) for reduced conduction losses
• 236W maximum power dissipation for thermal headroom
• 11nC typical gate charge for faster switching transitions
• 10V gate rating compatible with standard gate-drive voltages

Applications


• Ideal for industrial switch-mode power supplies and inverters
• Suitable for motor control stages in high-voltage systems
• Used with high-voltage DC-DC converters for energy conversion
• Can be used for hard-switching topologies in power electronics
• Appropriate for telecoms power distribution and auxiliary supplies

What package style is used and how does it affect board assembly?


The device is supplied in a PG-HSOF-8 surface-mount package which facilitates automated reflow soldering and compact PCB layouts while providing multiple thermal and electrical leads.

What gate-drive considerations should be made for reliable operation?


Keep the gate drive within ±10V and provide a low-impedance return path to minimise switching transients and ensure predictable turn-on and turn-off timing.

How does the temperature range influence deployment locations?


The rated operating span from -55°C to 150°C allows placement in both cold-start and high-temperature industrial enclosures without derating the basic switching capability.

What thermal management strategies are recommended for continuous operation?


Use adequate copper area or dedicated heatsinking under the package, ensure good PCB thermal vias, and consider airflow to maintain junction temperatures within safe limits.

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