Infineon EasyPACK Type N-Channel MOSFET, 65 A, 1200 V Enhancement Tray F3L11MR12W2M1HPB19BPSA1
- N° de stock RS:
- 349-248
- Référence fabricant:
- F3L11MR12W2M1HPB19BPSA1
- Fabricant:
- Infineon
Sous-total (1 unité)*
317,12 €
(TVA exclue)
383,72 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
En stock
- 18 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité |
|---|---|
| 1 + | 317,12 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 349-248
- Référence fabricant:
- F3L11MR12W2M1HPB19BPSA1
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 65A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Package Type | Tray | |
| Series | EasyPACK | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 16mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -40°C | |
| Forward Voltage Vf | 5.35V | |
| Maximum Power Dissipation Pd | 20mW | |
| Maximum Gate Source Voltage Vgs | 23 V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | IEC 60747, IEC 60068, RoHS, IEC 60749 | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 65A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Package Type Tray | ||
Series EasyPACK | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 16mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -40°C | ||
Forward Voltage Vf 5.35V | ||
Maximum Power Dissipation Pd 20mW | ||
Maximum Gate Source Voltage Vgs 23 V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals IEC 60747, IEC 60068, RoHS, IEC 60749 | ||
Automotive Standard No | ||
- Pays d'origine :
- DE
The Infineon EasyPACK 2B CoolSiC MOSFET 3 level module in NPC2 topology 1200 V, 11mΩ G1 with NTC, pre applied thermal interface material and PressFIT contact technology. The MOSFET features best in class packaging with a compact height of just 12 mm, designed for optimal performance in power electronics. It utilizes leading edge Wide Bandgap materials, enhancing its efficiency and reliability. The design incorporates very low module stray inductance, ensuring minimal power loss and improved switching behaviour.
Outstanding module efficiency
System cost advantages
System efficiency improvement
Reduced cooling requirements
Enabling higher frequency
Increase of power density
Liens connexes
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