TE Connectivity 0.5mm Pitch 200, 260 Way, Right Angle Board Mount Mount Small Outline DIMM Socket ,1.2 V ,500mA
- N° de stock RS:
- 481-965
- Référence fabricant:
- 2309410-3
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 400 unités)*
577,92 €
(TVA exclue)
699,28 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 15 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 577,92 € | 1,445 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 481-965
- Référence fabricant:
- 2309410-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Gender | Female | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 200, 260 | |
| Pitch | 0.5mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | Small Outline | |
| Current Rating | 500mA | |
| Voltage Rating | 1.2 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Gender Female | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 200, 260 | ||
Pitch 0.5mm | ||
Mounting Type Board Mount | ||
SDRAM Type Small Outline | ||
Current Rating 500mA | ||
Voltage Rating 1.2 V | ||
- Pays d'origine :
- CN
The TE Connectivity small outline (SO) DIMM socket is designed for high-performance memory applications, ensuring reliable connectivity in compact spaces. With a stack height of just 5.2 mm, this connector accommodates a right-angle module orientation, making it ideal for slim devices where space is at a premium. Its capability to support both 200 and 260 positions allows for flexibility in various DDR4 memory configurations. Engineered to meet stringent quality standards, this socket connection integrates seamlessly into printed circuit boards (PCBs), bolstering stability and performance. Perfectly suited for modern computing needs, this versatile solution is an essential component for efficient data transfer in cutting-edge technology.
Designed for easy surface mount termination
Enhanced reliability with copper alloy contact base material
High-temperature thermoplastic housing for durability in adverse conditions
Retention posts positioned at both ends for secure placement
Locking ejectors ensure stable module engagement
Enhanced reliability with copper alloy contact base material
High-temperature thermoplastic housing for durability in adverse conditions
Retention posts positioned at both ends for secure placement
Locking ejectors ensure stable module engagement
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