TE Connectivity 0.6mm Pitch 200 Way, Right Angled Board Mount Mount DDR DIMM Socket ,2.5 V ,500mA

Sous-total (1 plateau de 25 unités)*

165,18 €

(TVA exclue)

199,87 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 17 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +165,18 €6,607 €

*Prix donné à titre indicatif

N° de stock RS:
469-568
Référence fabricant:
1717468-3
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Memory Socket Type

DIMM Socket

Gender

Socket

Body Orientation

Right Angled

Contact Material

Copper Alloy

Contact Plating

Gold Flash

Number of Contacts

200

Pitch

0.6mm

Mounting Type

Board Mount

SDRAM Type

DDR

Current Rating

500mA

Voltage Rating

2.5 V

Pays d'origine :
CN
The TE Connectivity Double Data Rate (DDR) SO DIMM socket is a high-performance connector tailored for modern computing applications. With a stack height of just 6.5 mm, this right-angle module orientation is designed for optimal space efficiency in tight environments. Engineered for reliability, it accommodates 200 positions and is ideally suited for DDR SODIMM configurations. This socket provides seamless installation while ensuring robust electrical performance even under varying operational conditions. Its durable construction, featuring high-temperature thermoplastic housing and stainless steel latches, promises longevity, making it a suitable choice for motherboard integration in both consumer and industrial settings.

Optimised for Double Data Rate (DDR) applications, ensuring fast processing speeds
Innovative cam-in insertion style facilitates quick and secure installation
Locking ejector design provides enhanced module retention
Low halogen materials contribute to environmental sustainability
Versatile application range from personal computers to servers and embedded systems
Robust PCB retention method increases reliability during operation
Gold-flash plating enhances electrical conductivity and corrosion resistance

Liens connexes