Infineon, Type N-Channel IGBT Module, 10 A 1200 V EASY1B, Clamp
- N° de stock RS:
- 218-4344
- Référence fabricant:
- FP10R12W1T7B11BOMA1
- Fabricant:
- Infineon
Sous-total (1 plateau de 24 unités)*
456,888 €
(TVA exclue)
552,84 €
(TVA incluse)
Informations sur le stock actuellement non accessibles - Veuillez vérifier plus tard
Unité | Prix par unité | le plateau* |
|---|---|---|
| 24 + | 19,037 € | 456,89 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 218-4344
- Référence fabricant:
- FP10R12W1T7B11BOMA1
- Fabricant:
- Infineon
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Product Type | IGBT Module | |
| Maximum Continuous Collector Current Ic | 10A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Package Type | EASY1B | |
| Mount Type | Clamp | |
| Channel Type | Type N | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.82V | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Series | FP10 | |
| Length | 33.8mm | |
| Height | 12mm | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Product Type IGBT Module | ||
Maximum Continuous Collector Current Ic 10A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Package Type EASY1B | ||
Mount Type Clamp | ||
Channel Type Type N | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.82V | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Series FP10 | ||
Length 33.8mm | ||
Height 12mm | ||
Automotive Standard No | ||
The Infineon EasyPIM three phase input rectifier power integrated modules IGBT module with TRENCHSTOP IGBT7 technology. It has collector emitter voltage of 1200 V. It is used in auxiliary inverter, motor drives and air conditioning.
High power density
Compact design
PressFIT contact technology
Optimized trade-off between losses and EMI
Liens connexes
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