TE Connectivity 2.54 mm Pitch 28 Way DIP Surface Test IC Socket

The TE Connectivity DIP socket offers a reliable and efficient solution for PCB connectivity, designed specifically for those seeking durable electronic components. Recognised for its exceptional performance in signal applications, this socket caters to a multitude of environments. Constructed with a ladder frame style and standard pin layout, it ensures a secure and stable connection. The use of high-quality materials like copper and tin plating enhances both conductivity and longevity, making it ideal for a variety of circuit applications. With its vertical orientation and through-hole soldering method, integration into any circuit board is straightforward, allowing for flexibility in design. This socket not only meets industry standards for quality but also prioritises safety and compliance, making it a trusted choice in electronics.

Engineered for high durability and reliability in electronic applications