BGA7L1BN6E6327XTSA1 Infineon RF Amplifier Low Noise 13.6 dB, 6-Pin 960MHz TSNP-6-2
- N° de stock RS:
- 273-5226
- Référence fabricant:
- BGA7L1BN6E6327XTSA1
- Fabricant:
- Infineon
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 paquet de 10 unités)*
3,96 €
(TVA exclue)
4,79 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 08 avril 2027
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le paquet* |
|---|---|---|
| 10 - 990 | 0,396 € | 3,96 € |
| 1000 - 1990 | 0,312 € | 3,12 € |
| 2000 - 4990 | 0,306 € | 3,06 € |
| 5000 - 9990 | 0,299 € | 2,99 € |
| 10000 + | 0,294 € | 2,94 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 273-5226
- Référence fabricant:
- BGA7L1BN6E6327XTSA1
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Product Type | RF Amplifier | |
| Operating Frequency | 960MHz | |
| Amplifier Type | Low Noise | |
| Technology | Silicon Germanium | |
| Gain | 13.6dB | |
| Mount Type | Surface | |
| Package Type | TSNP-6-2 | |
| Minimum Supply Voltage | 1.5V | |
| Maximum Supply Voltage | 3.6V | |
| Pin Count | 6 | |
| Minimum Operating Temperature | -40°C | |
| Third Order Intercept OIP3 | 5dBm | |
| Noise Figure | 0.75dB | |
| Maximum Operating Temperature | 85°C | |
| Width | 0.7mm | |
| Standards/Approvals | JEDEC47/20/22 | |
| Height | 0.37mm | |
| Length | 1.1mm | |
| Series | BGA7L1BN6 | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Product Type RF Amplifier | ||
Operating Frequency 960MHz | ||
Amplifier Type Low Noise | ||
Technology Silicon Germanium | ||
Gain 13.6dB | ||
Mount Type Surface | ||
Package Type TSNP-6-2 | ||
Minimum Supply Voltage 1.5V | ||
Maximum Supply Voltage 3.6V | ||
Pin Count 6 | ||
Minimum Operating Temperature -40°C | ||
Third Order Intercept OIP3 5dBm | ||
Noise Figure 0.75dB | ||
Maximum Operating Temperature 85°C | ||
Width 0.7mm | ||
Standards/Approvals JEDEC47/20/22 | ||
Height 0.37mm | ||
Length 1.1mm | ||
Series BGA7L1BN6 | ||
Automotive Standard No | ||
- Pays d'origine :
- MY
Infineon BGA7L1BN6 Series RF Amplifier, 13.6dB Gain, 0.70dB Noise Figure - BGA7L1BN6E6327XTSA1
This RF amplifier is a silicon-germanium low-noise device designed to boost weak RF signals within communication systems. It operates around 960MHz and is intended for surface-mounted applications where a low-voltage supply and Compact footprint are required. The component is specified for non-automotive environments and functions across a wide ambient temperature range.
Features and Benefits:
• 13.6dB gain improves signal strength for front-end reception
• 0.70dB noise figure reduces added noise during amplification
• OIP3 5 dBm enhances linearity under moderate input power
• 1.5 to 3.6V supply supports low-voltage system designs
• TSNP-6-2 surface-mount package enables Compact PCB layouts
• 0.70dB noise figure reduces added noise during amplification
• OIP3 5 dBm enhances linearity under moderate input power
• 1.5 to 3.6V supply supports low-voltage system designs
• TSNP-6-2 surface-mount package enables Compact PCB layouts
Applications
• Suitable for 960MHz receiver front ends
• Ideal for SiGe low-noise RF designs
• Used with Compact wireless modules requiring low NF
• Can be used for low-voltage portable RF equipment
• Suitable for 6-pin RF amplifier package integration
• Ideal for SiGe low-noise RF designs
• Used with Compact wireless modules requiring low NF
• Can be used for low-voltage portable RF equipment
• Suitable for 6-pin RF amplifier package integration
What temperature range can it reliably operate within?
It is rated to operate between -40 and 85°C.
How many pins does the package present for PCB layout?
The device uses a 6-pin arrangement in a TSNP-6-2 package.
What technology is employed in the transistor structure?
The amplifier uses silicon-germanium technology.
What mounting method is required for assembly?
It is intended for surface mounting onto the PCB.
What standard approvals relate to environmental handling?
The component meets JEDEC 47/20/22 approvals.
Liens connexes
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