BGA855N6E6327XTSA1 Infineon RF Amplifier Low Noise 17.8 dB, 6-Pin 1300MHz TSNP

Sous-total (1 bobine de 12000 unités)*

2 964,00 €

(TVA exclue)

3 588,00 €

(TVA incluse)

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  • Expédition à partir du 22 avril 2027
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Unité
Prix par unité
la bobine*
12000 +0,247 €2 964,00 €

*Prix donné à titre indicatif

N° de stock RS:
258-0667
Référence fabricant:
BGA855N6E6327XTSA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

RF Amplifier

Amplifier Type

Low Noise

Operating Frequency

1300MHz

Technology

Silicon Germanium

Mount Type

Surface

Gain

17.8dB

Package Type

TSNP

Minimum Supply Voltage

1.1V

Pin Count

6

Maximum Supply Voltage

3.3V

P1dB - Compression Point

60mW

Noise Figure

1.1dB

Third Order Intercept OIP3

0dBm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Standards/Approvals

JEDEC47/20/22

Automotive Standard

No

Series

BGA855N6

Infineon BGA855N6 Series RF Amplifier, 0.60dB Noise Figure, 17.8dB Gain - BGA855N6E6327XTSA1


This RF amplifier is a silicon-germanium low-noise amplifier designed for single-frequency RF stages operating at 1300MHz. It is a surface-mount device supplied in a TSNP package and intended for systems requiring low-voltage operation and Compact board integration. The device functions across a wide temperature range and conforms to JEDEC47 mechanical standards for reliability in assembly and handling.

Features and Benefits:


• 0.60dB noise figure for improved weak-signal reception
• 17.8dB gain to increase signal amplitude with low distortion
• 1.1 to 3.3V supply range for low-voltage system compatibility
• P1dB 60 mW output compression point to maintain linearity under drive
• OIP3 0 dBm for third-order intermodulation characterisation

Applications


• Suitable for single-frequency receiver front-ends
• Ideal for short-range RF communication modules
• Used with Compact surface-mount transceiver assemblies
• Can be used for low-power wireless test platforms
• Suitable for laboratory evaluation of SiGe amplifier stages

What supply voltages are required for operation?


It operates from a minimum of 1.1V up to a maximum of 3.3V.

What thermal conditions can it tolerate during use?


The device is rated from -40 to 85°C for operating environments.

What package and mounting method does it use?


It is supplied in a TSNP package intended for surface mounting.

How many electrical connections does the device provide?


The component has a pin count of 6 for PCB interfacing.

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