BGAP2S30AE6327XTSA1 Infineon, RF Amplifier, 35 dB 4.2 GHz, 16-Pin PG-TSNP-16-12
- N° de stock RS:
- 349-420
- Référence fabricant:
- BGAP2S30AE6327XTSA1
- Fabricant:
- Infineon
Offre groupée disponible
Sous-total (1 unité)*
7,10 €
(TVA exclue)
8,59 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 07 décembre 2027
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité |
|---|---|
| 1 - 9 | 7,10 € |
| 10 - 99 | 6,39 € |
| 100 - 499 | 5,88 € |
| 500 - 999 | 5,46 € |
| 1000 + | 4,89 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 349-420
- Référence fabricant:
- BGAP2S30AE6327XTSA1
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Typical 3dB Bandwidth | 3300 → 4200MHz | |
| Typical Power Gain | 35 dB | |
| Typical Output Power | 28.5dBm | |
| Typical Noise Figure | 3.2dB | |
| Number of Channels per Chip | 1 | |
| Maximum Operating Frequency | 4.2 GHz | |
| Package Type | PG-TSNP-16-12 | |
| Pin Count | 16 | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Typical 3dB Bandwidth 3300 → 4200MHz | ||
Typical Power Gain 35 dB | ||
Typical Output Power 28.5dBm | ||
Typical Noise Figure 3.2dB | ||
Number of Channels per Chip 1 | ||
Maximum Operating Frequency 4.2 GHz | ||
Package Type PG-TSNP-16-12 | ||
Pin Count 16 | ||
- Pays d'origine :
- MY
The Infineon 3.3 to 4.2 GHz mid band driver amplifier that can be used as pre driver or driver in RF applications from massive MIMO 5G base stations to small cells and access points. The driver amplifier is typically placed between transceiver IC and power amplifier but can also be used as power amplifier for low power applications. The input and outputs are single-ended and internally matched to 50 Ω.
BiCMOS technology for an optimized performance
High gain and high power for fewer components in line up
Internal matching and saving external matching components
Easy design in and small area footprint
High gain and high power for fewer components in line up
Internal matching and saving external matching components
Easy design in and small area footprint
Liens connexes
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