Samtec CLP Series Horizontal Surface PCB Socket, 12-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1040
- Référence fabricant:
- CLP-106-02-G-D-BE-A-K-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1050 unités)*
2 361,45 €
(TVA exclue)
2 857,05 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 17 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1050 + | 2,249 € | 2 361,45 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1040
- Référence fabricant:
- CLP-106-02-G-D-BE-A-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 12 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 12 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 125°C | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 6 positions and surface mount lead style. It has 0.000254mm gold in contact area and 0.0000762mm on tail.
Dual row
Bottom entry style
Alignment pins
Polyimide film pick & place pad
Tape and reel packaging
Liens connexes
- Samtec CLP Series Horizontal Surface Mount PCB Socket 2-Row Through Hole Termination
- Samtec CLP Series Horizontal Surface Mount PCB Socket 2-Row Through Hole Termination
- Samtec CLP Series Horizontal Surface Mount PCB Socket 2-Row Through Hole Termination
- Samtec CLP Series Horizontal Surface Mount PCB Socket 2-Row Through Hole Termination
- Samtec CLP Series Straight Surface Mount PCB Socket 2-Row Solder Termination
- Samtec CLP Series Straight Surface Mount PCB Socket 2-Row Solder Termination
- Samtec CLP Series Vertical Surface Mount PCB Socket 2-Row Through Hole Termination
- Samtec CLP Series PCB Socket 2-Row, 1.27mm Pitch
