Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 0.635 mm Pitch, 4 Row, Shrouded
- N° de stock RS:
- 202-7907
- Référence fabricant:
- ADM6-60-01.5-L-4-2-A
- Fabricant:
- Samtec
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- N° de stock RS:
- 202-7907
- Référence fabricant:
- ADM6-60-01.5-L-4-2-A
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | ADM6 | |
| Product Type | PCB Header | |
| Pitch | 0.635mm | |
| Current | 1.34A | |
| Number of Contacts | 60 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series ADM6 | ||
Product Type PCB Header | ||
Pitch 0.635mm | ||
Current 1.34A | ||
Number of Contacts 60 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
- Pays d'origine :
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
Liens connexes
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