Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 644-469
- Référence fabricant:
- UDM6-40-4-01.5-L-A-TH-TR
- Fabricant:
- Samtec
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 unité)*
29,61 €
(TVA exclue)
35,83 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
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- 124 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité |
|---|---|
| 1 - 9 | 29,61 € |
| 10 + | 27,24 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 644-469
- Référence fabricant:
- UDM6-40-4-01.5-L-A-TH-TR
- Fabricant:
- Samtec
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Documentation technique
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | UDM6 | |
| Product Type | PCB Header | |
| Current | 15A | |
| Pitch | 0.635mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 240 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Row Pitch | 0.635mm | |
| Tail Pin Length | 1.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI-SIG | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series UDM6 | ||
Product Type PCB Header | ||
Current 15A | ||
Pitch 0.635mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 240 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Row Pitch 0.635mm | ||
Tail Pin Length 1.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI-SIG | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
Liens connexes
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