Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded
- N° de stock RS:
- 644-468
- Référence fabricant:
- UDM6-10-2-01.5-L-A-TH-TR
- Fabricant:
- Samtec
Offre groupée disponible
Sous-total (1 unité)*
15,71 €
(TVA exclue)
19,01 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 80,00 €
En stock
- Plus 116 unité(s) expédiée(s) à partir du 30 mars 2026
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Unité | Prix par unité |
|---|---|
| 1 - 9 | 15,71 € |
| 10 + | 14,45 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 644-468
- Référence fabricant:
- UDM6-10-2-01.5-L-A-TH-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Header | |
| Series | UDM6 | |
| Current | 15A | |
| Pitch | 0.635mm | |
| Number of Contacts | 240 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 0.635mm | |
| Termination Type | Solder | |
| Tail Pin Length | 1.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Header | ||
Series UDM6 | ||
Current 15A | ||
Pitch 0.635mm | ||
Number of Contacts 240 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 0.635mm | ||
Termination Type Solder | ||
Tail Pin Length 1.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
Liens connexes
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