Phoenix Contact MCDN Series Through Hole PCB Header, 8 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

Sous-total (1 paquet de 70 unités)*

281,38 €

(TVA exclue)

340,47 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Stocké-e par le fabricant
  • Prêt à être expédié à partir du 03 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +281,38 €4,02 €

*Prix donné à titre indicatif

N° de stock RS:
520-281
Référence fabricant:
1749353
Fabricant:
Phoenix Contact
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Phoenix Contact

Product Type

PCB Header

Series

MCDN

Current

8A

Pitch

3.81mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON FMC 1

Contact Material

Copper Alloy

Contact Plating

Tin over Nickel

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Tail Pin Length

1.4mm

Contact Gender

Male

Mating Pin Length

1.4mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160V

Pays d'origine :
DE
The Phoenix Contact PCB header, part of the MCDN 1.5/-G1-THR series, is designed to seamlessly integrate into various electronic devices, enhancing connectivity options with minimal design constraints. The product showcases a robust construction that supports a nominal current of 8 A and rated voltage up to 160 V, ensuring reliable performance across a myriad of applications. Its unique pin layout and through-hole reflow capability make it an ideal choice for complex circuit board designs, enabling higher contact density without compromising on functionality. Additionally, the black colour and durable material construction exemplify a modern edge while maintaining compliance with international standards, giving you peace of mind in quality and reliability. This product is crafted to adapt effortlessly to different mounting methods, making it invaluable for professionals seeking versatility in their electronic solutions.

Designed for maximum compatibility with multiple connection technologies

Ideal for projects requiring enhanced contact density across various device designs

Crafted to comply with WEEE and RoHS environmental regulations

Robust construction is suitable for high-performance applications in demanding environments

Supports integration into SMT soldering processes, streamlining production

Offered in a convenient packing unit, ensuring easy handling and inventory management

Technical design recommendations assist in optimal soldering process application

Liens connexes

Soyez le/la premier·ère à être informé de nos nouveautés produits et de nos offres spéciales.

adresse e-mail

Les données personnelles que vous nous fournissez en vous inscrivant à cette liste de diffusion seront traitées conformément à notre politique de confidentialité.