Phoenix Contact MCDN Series Through Hole PCB Header, 8 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

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Sous-total (1 paquet de 70 unités)*

360,59 €

(TVA exclue)

436,31 €

(TVA incluse)

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  • Expédition à partir du 06 février 2026
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le paquet
Prix par unité*
1 +360,59 €5,151 €

*Prix donné à titre indicatif

N° de stock RS:
520-281
Référence fabricant:
1749353
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Series

MCDN

Current

8A

Pitch

3.81mm

Number of Contacts

8

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Tin over Nickel

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3.81mm

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

1.4mm

Mating Pin Length

1.4mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact PCB header, part of the MCDN 1.5/-G1-THR series, is designed to seamlessly integrate into various electronic devices, enhancing connectivity options with minimal design constraints. The product showcases a robust construction that supports a nominal current of 8 A and rated voltage up to 160 V, ensuring reliable performance across a myriad of applications. Its unique pin layout and through-hole reflow capability make it an ideal choice for complex circuit board designs, enabling higher contact density without compromising on functionality. Additionally, the black colour and durable material construction exemplify a modern edge while maintaining compliance with international standards, giving you peace of mind in quality and reliability. This product is crafted to adapt effortlessly to different mounting methods, making it invaluable for professionals seeking versatility in their electronic solutions.

Designed for maximum compatibility with multiple connection technologies

Ideal for projects requiring enhanced contact density across various device designs

Crafted to comply with WEEE and RoHS environmental regulations

Robust construction is suitable for high-performance applications in demanding environments

Supports integration into SMT soldering processes, streamlining production

Offered in a convenient packing unit, ensuring easy handling and inventory management

Technical design recommendations assist in optimal soldering process application

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