Phoenix Contact MCDN Series Through Hole PCB Header, 6 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

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Sous-total (1 paquet de 90 unités)*

290,54 €

(TVA exclue)

351,55 €

(TVA incluse)

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  • Expédition à partir du 05 février 2026
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le paquet
Prix par unité*
1 +290,54 €3,228 €

*Prix donné à titre indicatif

N° de stock RS:
492-767
Référence fabricant:
1749340
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Current

8A

Pitch

3.81mm

Number of Contacts

6

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON FMC 1

Contact Material

Copper Alloy

Contact Plating

Tin over Nickel

Row Pitch

3.81mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Tail Pin Length

1.4mm

Maximum Operating Temperature

100°C

Contact Gender

Male

Mating Pin Length

1.4mm

Standards/Approvals

cULus Recognised (E60425-20110128), DIN EN 61760-1, IEC 60068-2-58, IEC 60068-2-70:1995-12, IEC 60068-2-82/JEDEC JESD 201, IEC 60112, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, IPC/JEDEC J-STD-020-C, ISO 6988:1985-02, UL 94 V0, VDE (40011723)

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact MCDN 1.5/3-G1-3.81 P14THR is a high-quality PCB header designed for effective integration into various electronic devices. This versatile component boasts a linear pinning layout and is specifically suitable for through hole reflow soldering, catering to a range of connection technologies. Its robust construction and thoughtful design enable higher contact density while allowing maximum flexibility in device design. The product ranges in applications requiring reliable electrical connections, making it essential for contemporary electronic assemblies. With a nominal current capacity of 8 A and a rated voltage of up to 160 V, this PCB header ensures dependable and safe operation across diverse environments, from offices to industrial settings. Moreover, the innovative design affords effortless assembly and durability, positioning it as an ideal choice for manufacturers seeking quality and performance.

Designed for seamless integration into the SMT soldering process

Allows for enhanced flexibility in device configurations and layout

Manufactured to meet stringent quality standards for reliability

Accommodates multiple connection technologies for diverse applications

Features a compact design that facilitates higher density connections

Ensures efficient heat management during the soldering process

Constructed with materials that comply with WEEE and RoHS regulations

Provides a moisture-sensitive level rating for safe handling

Supports a wide operating temperature range for versatile applications

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