Phoenix Contact MCDN Series Wave Soldering Mount PCB Header, 20 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 paquet de 130 unités)*

218,52 €

(TVA exclue)

264,41 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 02 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +218,52 €1,681 €

*Prix donné à titre indicatif

N° de stock RS:
558-031
Référence fabricant:
1749528
Fabricant:
Phoenix Contact
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Current

8A

Pitch

3.81mm

Number of Contacts

20

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Nickel, Tin

Minimum Operating Temperature

-40°C

Row Pitch

3.81mm

Termination Type

Solder

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

2.6mm

Mating Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

Pays d'origine :
DE
The Phoenix Contact PCB header is meticulously designed for seamless integration into the SMT soldering processes, ensuring reliability and efficiency in electronic connections. This component boasts a flexible design that accommodates various connection technologies, allowing for greater versatility in device architecture. With a robust construction featuring a nominal current of 8 A and a rated voltage of 160 V, it provides dependable performance across multiple applications. The through-hole reflow technology enhances assembly precision, while the compact dimensions ensure ease of installation without compromising on quality. This product is an ideal solution for engineers seeking to optimise space and contact density in their designs.

Integrates effortlessly with SMT soldering processes for enhanced efficiency

Offers flexibility for various connection technologies in device design

Enables high contact density through multi-level conductor connections

Presents a compact footprint, allowing for space-efficient applications

Manufactured from high-quality materials ensuring durability and reliability

Complies with WEEE/RoHS for environmentally-friendly operation

Designed for effective thermal management during the soldering process

Tested for a wide temperature range, suitable for diverse operational environments

Features multiple rows and potential connections for versatile circuit options

Liens connexes