TE Connectivity AMP HPI Series Right Angle Board PCB Header, 3 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

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Sous-total (1 tube de 660 unités)*

206,69 €

(TVA exclue)

250,09 €

(TVA incluse)

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  • Expédition à partir du 23 février 2026
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Tube(s)
le tube
Prix par unité*
1 +206,69 €0,313 €

*Prix donné à titre indicatif

N° de stock RS:
475-009
Numéro d'article Distrelec:
304-50-321
Référence fabricant:
1734829-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMP HPI

Product Type

PCB Header

Pitch

1.25mm

Current

0.8A

Housing Material

Polyamide 9T Fibreglass

Number of Contacts

3

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

1.25mm

Maximum Operating Temperature

265°C

Tail Pin Length

2.3mm

Standards/Approvals

UL 94 V-0

Voltage

125 V

Pays d'origine :
CN
The TE Connectivity PCB mount header is engineered for reliably connecting wires to a printed circuit board, offering an optimal solution for various electronic applications. Designed with a right-angle orientation, the header features three positions, making it ideal for compact spaces and improving circuit design efficiency. With its partially shrouded header type, it ensures secure connectivity while reducing the risk of misalignment during mating. This product is built to withstand operational voltages of up to 125 VDC, providing a robust performance in demanding environments. The housing, composed of PA 9T GF, enhances durability, while meticulous attention to plating materials ensures minimal wear and consistent conductivity over time.

Designed for wire-to-board connectivity

Offers increased flexibility with right-angle PCB mount orientation

Features a partially shrouded design for enhanced mating security

Constructed from durable materials to withstand various environmental factors

Operates efficiently under high voltage conditions

Minimises the risk of misalignment due to its advanced design

Provides a compact footprint for space-constrained applications

Facilitates straightforward soldering and assembly processes

Reduces contact wear through quality plating materials

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