TE Connectivity AMP HPI Series Right Angle Board PCB Header, 10 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

Sous-total (1 tube de 301 unités)*

208,82 €

(TVA exclue)

252,67 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +208,82 €0,694 €

*Prix donné à titre indicatif

N° de stock RS:
471-484
Référence fabricant:
1-1734829-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Pitch

1.25mm

Current

0.8A

Number of Contacts

10

Housing Material

Polyamide 9T Fibreglass

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Row Pitch

1.25mm

Termination Type

Solder

Tail Pin Length

2.3mm

Standards/Approvals

UL 94 V-0

Voltage

125 V

Distrelec Product Id

304-51-367

Pays d'origine :
CN
The TE Connectivity 1.25 wtb hdr dip is expertly crafted for seamless wire-to-board connections, offering unmatched performance in electronic applications. Designed with precision, it features right-angle PCB mounting and a robust, partially shrouded header type that ensures stable alignment and secure mating. The compact design enables effective space utilization, while the fully loaded configuration supports a range of circuit applications. Ideal for modern electronics, this connector promises reliability and ease of use in various commercial and industrial settings.

Offers exceptional durability and performance for various electronic applications

Designed to simplify installation with its right-angle mounting orientation

Provides enhanced contact reliability with its nickel underplating

Developed for efficient signal transmission, supporting applications that require precision

Guaranteed compliance with EU directives, ensuring environmental responsibility

Features a matte finish for reduced friction during mating and unmating

Utilizes high-quality PA 9T GF housing material for added strength and resilience

Compatible with an array of other TE components for versatile integration

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