TE Connectivity AMP HPI Series Vertical Board PCB Header, 13 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

Sous-total (1 bobine de 1000 unités)*

1 209,12 €

(TVA exclue)

1 463,04 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +1 209,12 €1,209 €

*Prix donné à titre indicatif

N° de stock RS:
479-300
Référence fabricant:
1734261-3
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Series

AMP HPI

Product Type

PCB Header

Pitch

1.25mm

Number of Contacts

13

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire to Board High Performance Interconnect (HPI) Connector System

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

1.25mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

No

Distrelec Product Id

304-50-310

Pays d'origine :
CN
The TE Connectivity 1.25mm High Performance Interconnect (HPI) connector system combines superior design with versatile functionality, making it a prime choice for diverse applications. This product is meticulously crafted for seamless integration into business and industrial equipment, enhancing connectivity with reliability and performance. It features a compact footprint that maximises PCB real estate while ensuring robust termination options. Its design supports both surface mount technology (SMT) and through-hole configurations, accommodating a wide range of device architectures. The polarized design of this connector prevents misalignment during installation, ensuring consistent and dependable connections throughout its lifespan. Its exceptional ability to handle up to 3.00 Amps makes it suitable for transferring both signal and low-power applications, underscoring its versatility across multiple sectors.

Facilitates easy integration into various electronic systems

Supports both SMT and DIP mounting styles to cater to diverse application needs

Polarized design ensures correct mating with compatible housings

Provides design flexibility with a compact PCB footprint

Equipped with an external locking feature for enhanced mating reliability

Enables efficient space management without compromising on performance

Designed to accommodate a broad AWG range, ensuring compatibility with various wire gauges

Robust construction designed to withstand operational challenges across different sectors

Liens connexes