TE Connectivity PT30 XFP Series Vertical Board PCB Header, 29 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded
- N° de stock RS:
- 474-654
- Numéro d'article Distrelec:
- 304-63-151
- Référence fabricant:
- 1735869-1
- Fabricant:
- TE Connectivity
Sous-total (300 unités, sur une bobine de 300)*
1 052,53 €
(TVA exclue)
1 273,56 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 09 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 052,53 € | 3,508 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 474-654
- Numéro d'article Distrelec:
- 304-63-151
- Référence fabricant:
- 1735869-1
- Fabricant:
- TE Connectivity
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | PCB Header | |
| Series | PT30 XFP | |
| Current | 1.5A | |
| Pitch | 1.27mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 29 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Board | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold over Nickel | |
| Termination Type | Surface Mount | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type PCB Header | ||
Series PT30 XFP | ||
Current 1.5A | ||
Pitch 1.27mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 29 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Board | ||
Connector System Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold over Nickel | ||
Termination Type Surface Mount | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0 | ||
- Pays d'origine :
- CN
The TE Connectivity SAS backplane receptacle is expertly engineered for vertical surface mounting, offering an innovative solution for seamless connectivity. Designed for high-performance applications, it enhances data transmission through its advanced configuration featuring 29 positions in a single row. This receptacle ensures superior durability and reliability, making it an ideal choice for varied circuit applications involving both power and signal. Crafted with high-temperature housing materials, it withstands challenging environments without compromising performance. Its thoughtful design facilitates effortless integration with compatible connectors, ensuring optimal functionality across a range of electronic devices.
Surface mount termination method for efficient PCB integration
Highly resilient thermoplastic housing ensures longevity
Vertical PCB mount orientation optimises space utilisation
Nickel underplating and gold mating area plating enhance connection reliability
Low halogen content supports eco-friendly initiatives
Designed for robust performance in high-temperature conditions
Reflow solder capable for ease of manufacturing
Complies with EU RoHS and ELV directives for environmental safety
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