TE Connectivity PT30 XFP Series Vertical Board PCB Header, 29 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 300 unités)*

957,38 €

(TVA exclue)

1 158,43 €

(TVA incluse)

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  • Expédition à partir du 27 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +957,38 €3,191 €

*Prix donné à titre indicatif

N° de stock RS:
474-654
Référence fabricant:
1735869-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

PT30 XFP

Current

1.5A

Pitch

1.27mm

Housing Material

Thermoplastic

Number of Contacts

29

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold over Nickel

Termination Type

Surface Mount

Row Pitch

1.27mm

Maximum Operating Temperature

260°C

Standards/Approvals

EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0

Distrelec Product Id

304-63-151

Pays d'origine :
CN
The TE Connectivity SAS backplane receptacle is expertly engineered for vertical surface mounting, offering an innovative solution for seamless connectivity. Designed for high-performance applications, it enhances data transmission through its advanced configuration featuring 29 positions in a single row. This receptacle ensures superior durability and reliability, making it an ideal choice for varied circuit applications involving both power and signal. Crafted with high-temperature housing materials, it withstands challenging environments without compromising performance. Its thoughtful design facilitates effortless integration with compatible connectors, ensuring optimal functionality across a range of electronic devices.

Surface mount termination method for efficient PCB integration

Highly resilient thermoplastic housing ensures longevity

Vertical PCB mount orientation optimises space utilisation

Nickel underplating and gold mating area plating enhance connection reliability

Low halogen content supports eco-friendly initiatives

Designed for robust performance in high-temperature conditions

Reflow solder capable for ease of manufacturing

Complies with EU RoHS and ELV directives for environmental safety

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