TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

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Sous-total (1 paquet de 120 unités)*

268,78 €

(TVA exclue)

325,22 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +268,78 €2,24 €

*Prix donné à titre indicatif

N° de stock RS:
478-123
Référence fabricant:
5-104178-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

1.27mm

Current

3.6A

Number of Contacts

8

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Termination Type

Solder

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-50-850

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is engineered for versatile board-to-board connections, optimising space and enhancing functionality in your projects. With a sleek vertical orientation, this component supports seamless integration in designs that prioritise efficiency. Featuring eight positions on a 1.27 mm centreline, it ensures a secure and stable connection while accommodating various applications in electronic assemblies. Constructed with high-quality materials, this unshrouded header is designed for through-hole soldering, guaranteeing a robust and durable attachment to printed circuit boards. Its excellent compatibility with AMPMODU System 50 exemplifies its adaptability, making it an ideal choice for modern electronics requiring reliable signal transmission.

Offers a parallel board-to-board configuration for increased layout flexibility

Designed with an operating temperature range that supports demanding environments

Facilitates high current delivery, ensuring robust performance in a compact form

Constructed from low halogen materials, contributing to environmentally friendly practices

Assures compatibility with both UL and CSA standards for trustworthy quality assurance

Includes a retention mechanism to enhance stability during operation

Supports a high insulation resistance value, ensuring minimal signal loss

Provides an efficient mating interface, enhancing connection security

Engineered for easy integration into various electronic applications

Available in bulk packaging for convenient procurement

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