TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 1.27 mm Pitch, 1 Row, Unshrouded

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Sous-total (1 paquet de 150 unités)*

243,18 €

(TVA exclue)

294,25 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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Paquet(s)
le paquet
Prix par unité*
1 +243,18 €1,621 €

*Prix donné à titre indicatif

N° de stock RS:
473-654
Numéro d'article Distrelec:
304-50-851
Référence fabricant:
5-104178-6
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3.6A

Pitch

1.27mm

Number of Contacts

10

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

RoHS

Voltage

30 V

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is a versatile connector designed for board-to-board applications, featuring an intricate structure suitable for high-density environments. This component boasts an unshrouded design, allowing easy access for mating connections while maintaining a secure fit. With a vertical orientation and a 10-position configuration, it is optimised for tight spaces without compromising functionality. Its robust construction, crafted from high-quality materials, ensures reliable performance across a wide temperature range and various operating conditions. A perfect solution for modern electronic assemblies, this header offers enhanced reliability and efficiency, making it ideal for a wide spectrum of applications in the electronics industry.

Designed for ease of use in tight spaces

Efficiently accommodates high-density connections

Crafted from durable materials for long-lasting performance

Offers reliable connection integrity under various conditions

Optimised for compatibility with contemporary electronic systems

Enables straightforward mating with minimal alignment concerns

Provides excellent thermal and electrical stability in operation

Supports through-hole soldering for robust assembly

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