TE Connectivity AMPMODU Series Vertical Board PCB Header, 40 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Sous-total (1 paquet de 20 unités)*

268,69 €

(TVA exclue)

325,11 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 19 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +268,69 €13,435 €

*Prix donné à titre indicatif

N° de stock RS:
469-031
Numéro d'article Distrelec:
304-53-754
Référence fabricant:
2-146501-0
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

40

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Brass

Row Pitch

2.54mm

Termination Type

Solder

Tail Pin Length

8.38mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Pays d'origine :
MX
The TE Connectivity High-performance PCB mount header designed for seamless board-to-board connections. With its unshrouded header type and vertical orientation, this connector provides flexibility and ease of use during assembly. Its robust construction features a thermoplastic housing that ensures durability, while the gold-plated contacts guarantee reliable electrical performance. Specially engineered for parallel board-to-board configurations, it supports up to 40 positions across two rows, making it ideal for applications requiring compact yet efficient connectivity solutions in signal circuit applications. Additionally, the absence of sealing and alignment features simplifies installation, allowing for a straightforward connection process. This connector will thrive in various settings, delivering consistent performance in demanding environments.

Designed for board-to-board applications with staggered positions

Enables effective signal transmission with high insulation resistance

Facilitates easy installation with through-hole soldering termination

Boasts a compact size with optimal row-to-row spacing

Offers a stackable feature to optimise space utilisation on PCB

Constructed from high-quality thermoplastic to ensure longevity

Exceeds industry standards for compliance and safety

Contains square pin contacts for enhanced mating stability

Provided in packaging quantities that support bulk assembly needs

Liens connexes