TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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Sous-total (1 paquet de 7 unités)*

224,85 €

(TVA exclue)

272,07 €

(TVA incluse)

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  • Expédition à partir du 06 juillet 2026
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le paquet
Prix par unité*
1 +224,85 €32,121 €

*Prix donné à titre indicatif

N° de stock RS:
509-961
Numéro d'article Distrelec:
304-50-755
Référence fabricant:
4-146494-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

2.54mm

Contact Gender

Male

Maximum Operating Temperature

125°C

Standards/Approvals

CSA LR7189, UL E28476

Mating Pin Length

8.38mm

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is designed for vertical mounting and facilitates seamless board-to-board connections, making it ideal for compact applications requiring high-density interconnects. With an impressive 80 positions and a reliable 2.54 mm centreline, this unshrouded header ensures robust connectivity while supporting a variety of electronic configurations. The product's gold-plated contacts enhance conductivity and durability, ensuring excellent performance even in challenging conditions. Crafted from thermoplastic material, it withstands a wide operating temperature range, making it suitable for diverse environments. This header not only meets industry standards but also offers stackable configurations, allowing for versatile installation options in demanding applications.

Unshrouded design optimises space while maintaining connection integrity

Offers a high contact rating of 3 A for enhanced performance

Thermoplastic housing provides excellent durability and heat resistance

Compatible with wave soldering processes, facilitating efficient assembly

Features a copper alloy contact base for improved electrical conductivity

Stackable design enhances flexibility in multi-layered applications

The product is compliant with prominent industry standards for reliable use

Included packaging quantity of 75 ensures sufficient supply for medium-scale projects

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