TE Connectivity AMPMODU Series Vertical Board PCB Header, 100 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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Sous-total (1 paquet de 8 unités)*

254,04 €

(TVA exclue)

307,39 €

(TVA incluse)

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Temporairement en rupture de stock
  • Expédition à partir du 16 mars 2026
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Paquet(s)
le paquet
Prix par unité*
1 +254,04 €31,755 €

*Prix donné à titre indicatif

N° de stock RS:
469-300
Numéro d'article Distrelec:
304-54-210
Référence fabricant:
5-829822-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

5A

Housing Material

Polybutylene Terephthalate Fibreglass

Number of Contacts

100

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Tin

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

125°C

Tail Pin Length

3mm

Mating Pin Length

5mm

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Pays d'origine :
DE
The TE Connectivity Mount header is a precision-engineered solution designed for vertical board-to-board connectivity. Tailored for hybrid applications requiring reliable, high-density connections, this product features a breakaway header system that simplifies assembly and reduces potential errors during installation. With options for 50 or 100 positions, it offers exceptional versatility for various circuit applications. The robust design includes gold plating for superior conductivity and resistance to corrosion, ensuring optimal performance across a wide temperature range. Ideal for demanding environments, this header provides peace of mind through stringent compliance with industry regulations.

Breakaway design enhances assembly efficiency

Gold plating improves signal integrity and durability

Robust construction supports reliable operation in challenging applications

Stackable configuration optimises space utilisation

Vertical orientation simplifies PCB layout

Compatible with various TE products for versatile integration

Insulation resistance ensures robust electrical performance

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