Infineon OptiMOS 3 Type N-Channel MOSFET, 25 A, 250 V Enhancement, 8-Pin TDSON BSC600N25NS3GATMA1

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13,97 €

(TVA exclue)

16,905 €

(TVA incluse)

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5 +2,794 €13,97 €

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N° de stock RS:
906-4303
Référence fabricant:
BSC600N25NS3GATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

25A

Maximum Drain Source Voltage Vds

250V

Package Type

TDSON

Series

OptiMOS 3

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

60mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

22nC

Maximum Power Dissipation Pd

125W

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Standards/Approvals

No

Height

1.1mm

Length

6.1mm

Automotive Standard

No

Statut RoHS : Exempté

Infineon OptiMOS 3 Series MOSFET, 250V Drain Source Voltage, 25A Continuous Drain Current - BSC600N25NS3GATMA1


This MOSFET is a high-voltage N-channel transistor designed for power switching in surface‑mount applications. It operates across an extended thermal range and is suited to circuits requiring robust drain‑to‑source voltage handling and moderate continuous current. The device is supplied in an 8‑pin TDSON package for compact board‑level integration.

Features and Benefits:


• 250V drain voltage enables high‑voltage switching applications
• 25A continuous current supports substantial load handling
• 60mΩ Rds(on) reduces conduction losses during operation
• 22nC typical gate charge enables responsive switching performance
• 125W maximum power dissipation allows elevated thermal loading

Applications


• Suitable for high‑voltage DC-DC converters on power boards
• Ideal for synchronous rectification in power supplies
• Used with motor‑drive stages requiring 25A handling
• Can be used for switch‑mode power supplies with tight footprints
• Appropriate for industrial switching circuits exposed to temperature extremes

What gate voltage limits should be observed during design?


The gate‑source voltage must not exceed 20V to prevent gate‑oxide stress and ensure device reliability.

How does the channel type affect circuit topology choices?


As an N‑channel enhancement device, it is typically placed on the low‑side of switches or used in synchronous topologies for improved efficiency.

What thermal environment can it tolerate during operation?


The component functions from -55°C up to 150°C, permitting use in wide‑temperature installations where ambient conditions vary.

Which package mounting considerations are recommended?


The TDSON surface‑mount format requires appropriate PCB thermal pads and soldering profiles to manage heat dissipation and mechanical stability.

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