Infineon OptiMOS Type N-Channel MOSFET, 30 A, 75 V Enhancement, 3-Pin TO-252 IPD30N08S2L21ATMA1

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25,20 €

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30,50 €

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N° de stock RS:
827-5120
Référence fabricant:
IPD30N08S2L21ATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

30A

Maximum Drain Source Voltage Vds

75V

Series

OptiMOS

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

26mΩ

Channel Mode

Enhancement

Forward Voltage Vf

0.9V

Maximum Power Dissipation Pd

136W

Typical Gate Charge Qg @ Vgs

56nC

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

175°C

Height

2.41mm

Length

6.73mm

Standards/Approvals

No

Automotive Standard

AEC-Q101

Statut RoHS non applicable

Infineon OptiMOS Series MOSFET, 75V Maximum Drain Source Voltage, 30A Maximum Continuous Drain Current - IPD30N08S2L21ATMA1


This MOSFET is a power switching transistor designed for demanding electronic systems, providing controlled conduction between drain and source in N-channel enhancement-mode configurations. It is intended for surface-mount assembly in compact power designs and for use where elevated operating temperatures and automotive-grade qualification are required.

Features and Benefits:


• 75V drain voltage enabling robust high-voltage switching
• 30A continuous current supporting substantial load delivery
• 26mΩ low Rds(on) reducing conduction losses
• 136W dissipation capacity aiding thermal margin in designs
• 56nC typical gate charge improving switching speed control
• ±20V gate tolerance allowing flexible gate-drive schemes

Applications


• Suitable for automotive DC-DC converter stages
• Ideal for synchronous rectification in power supplies
• Used with motor-drive inverter front-end circuits
• Can be used for high-efficiency point-of-load converters
• Suitable for board-level power management in vehicles

What packaging type should designers expect for PCB layout?


The device is supplied in a TO-252 package intended for surface mounting, which affects land-pattern and thermal-pad design.

How does the device handle extreme ambient conditions?


It is rated to operate across a wide temperature span from -55°C up to 175°C to suit high-temperature environments.

What gate-drive considerations are required for control circuitry?


The maximum gate-source rating is ±20V

gate-drive circuits should limit excursions within this range and account for the 56nC typical gate charge when sizing drivers.

Are there specific thermal performance constraints to plan for?


With a maximum power dissipation of 136W, thermal management must consider conduction paths and board-level heat sinking to maintain junction limits.

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