Vishay IRFBG30 Type N-Channel Power MOSFET, 3.1 A, 1 kV Enhancement, 3-Pin TO-220AB IRFBG30PBF

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4,20 €

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5,08 €

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N° de stock RS:
541-1146
Numéro d'article Distrelec:
171-15-229
Référence fabricant:
IRFBG30PBF
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

3.1A

Maximum Drain Source Voltage Vds

1kV

Package Type

TO-220AB

Series

IRFBG30

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.8V

Typical Gate Charge Qg @ Vgs

80nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

125W

Maximum Operating Temperature

150°C

Width

4.7mm

Standards/Approvals

RoHS

Length

10.41mm

Height

9.01mm

Automotive Standard

No

Pays d'origine :
CN

Vishay IRFBG30 Series Power MOSFET, 1000V Maximum Drain Source Voltage, 125W Maximum Power Dissipation - IRFBG30PBF


This power MOSFET is a high-voltage N-channel enhancement device designed for switching and power conversion in industrial electronic systems. It is supplied in a through-hole TO-220AB package and operates across a wide thermal range, making it suitable for demanding environments where sustained power handling and robust voltage tolerance are required.

Features and Benefits:


• 1000V drain-source rating enables high-voltage switching applications
• 125W maximum dissipation permits sustained power handling
• 5Ω maximum Rds(on) supports controlled conduction losses
• 3.1A continuous drain current suits moderate current loads
• 80nC typical gate charge facilitates predictable gate-drive requirements
• -55°C to 150°C operating range ensures wide-temperature reliability

Applications


• Suitable for high-voltage power supplies and converters
• Ideal for industrial motor-drive gate stages
• Used with avalanche protection in energy-management circuits
• Can be used for isolated switching in mains-related equipment
• Suitable for lab and prototyping through-hole assembly

What gate-voltage limitations should be observed during design?


The device must not exceed a gate-source voltage of 20V to prevent gate-oxide stress.

How should thermal considerations be handled on a PCB-mounted assembly?


Mounting in a TO-220AB configuration with a suitable heatsink and low-thermal-resistance fastening improves heat transfer for the 125W dissipation rating.

What conduction behaviour can be expected at high drain voltages?


With a maximum drain-source voltage of 1000V and a maximum continuous drain current of 3.1A, designers should size snubbers and protection to manage switching transients and limit peak stress.

Are there constraints on package mounting or pin count for hardware layouts?


The part uses a three-pin through-hole arrangement, allowing straightforward insertion and mechanical fixation for prototyping or repair.

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