Infineon IPT N-Channel MOSFET, 315 A, 100 V Enhancement HSOF IPT015N10NF2SATMA1

Sous-total (1 bobine de 1800 unités)*

3 664,80 €

(TVA exclue)

4 435,20 €

(TVA incluse)

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  • Expédition à partir du 01 février 2027
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Prix par unité
la bobine*
1800 +2,036 €3 664,80 €

*Prix donné à titre indicatif

N° de stock RS:
259-2644
Référence fabricant:
IPT015N10NF2SATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

315A

Maximum Drain Source Voltage Vds

100V

Series

IPT

Package Type

HSOF

Mount Type

Surface

Maximum Drain Source Resistance Rds

1.50mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Maximum Operating Temperature

+175°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon IPT Series MOSFET, 100V Drain-Source Voltage, 315A Continuous Drain Current - IPT015N10NF2SATMA1


This MOSFET is a high-power N-channel transistor designed for surface-mount applications where robust switching and wide temperature endurance are required. It operates across an extensive temperature range and is intended for systems demanding substantial continuous current handling while maintaining low conduction losses. The device is supplied in a heat-sinking HSOF package suitable for high-current board-level integration.

Features and Benefits:


• 1.50mΩ Rds(on) enabling reduced conduction losses
• 315A continuous drain current supporting heavy loads
• 100V Vds permitting higher-voltage switching duties
• 1.2V forward voltage improving conduction efficiency
• -55°C to +175°C operational range enabling harsh environments

Applications


• Suitable for high-current motor drive stages
• Ideal for DC-DC converters in power racks
• Used with power distribution assemblies on boards
• Can be used for high-power switching in industrial systems
• Suitable for Compact heat-sinked surface-mount layouts

What package type is used for thermal dissipation?


It is provided in an HSOF package designed for enhanced heat transfer to external sinks.

Which mounting method is recommended for PCB assembly?


The device is intended for surface mounting to enable low-inductance board layout.

What channel conduction type does the device employ?


It uses an enhancement-mode N-channel configuration for controlled switching.

Is the product suitable for automotive standardisation?


It is not specified as meeting automotive standards but conforms to RoHS requirements.

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