TE Connectivity 0.6mm Pitch 200 Way, Right Angle Board Mount Mount Double Data Rate (DDR) 2 DIMM Socket ,1.8 V ,500mA
- N° de stock RS:
- 526-323
- Référence fabricant:
- 1565918-4
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 150 unités)*
956,27 €
(TVA exclue)
1 157,09 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 13 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 956,27 € | 6,375 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 526-323
- Référence fabricant:
- 1565918-4
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash | |
| Number of Contacts | 200 | |
| Pitch | 0.6mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | Double Data Rate (DDR) 2 | |
| Current Rating | 500mA | |
| Voltage Rating | 1.8 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 200 | ||
Pitch 0.6mm | ||
Mounting Type Board Mount | ||
SDRAM Type Double Data Rate (DDR) 2 | ||
Current Rating 500mA | ||
Voltage Rating 1.8 V | ||
- Pays d'origine :
- CN
The TE Connectivity memory socket offers innovative connections designed for performance in todays high-speed applications. With its right-angle module orientation and robust design, it accommodates a double data rate (DDR) for superior speed and efficiency in data transfer. The socket boasts a 5.2 mm stack height, ensuring a compact footprint ideal for space-constrained environments. Engineered for a 200-position configuration, this connector provides ample space for secure and reliable connections, making it perfect for DDR2 SO DIMM applications. The thoughtful design, featuring high-temperature thermoplastic housing and stainless steel latches, not only enhances durability but also ensures reliable performance across a wide operating temperature range. Perfectly suited for modern electronic demands, this socket is an indispensable component in optimising memory module performance and reliability for various applications.
Designed to accommodate DDR2 interface technology
Optimised for high-speed data transfer with minimal signal interference
Constructed with durable materials to withstand harsh environmental conditions
Offers both standard and reverse keying for secure mating alignment
Facilitates easy mounting with a surface mount termination method
Supports a wide range of operating temperatures for versatile applications
Features low halogen content, adhering to environmental safety standards
Allows for multiple configuration options with its flexible bay design
Optimised for high-speed data transfer with minimal signal interference
Constructed with durable materials to withstand harsh environmental conditions
Offers both standard and reverse keying for secure mating alignment
Facilitates easy mounting with a surface mount termination method
Supports a wide range of operating temperatures for versatile applications
Features low halogen content, adhering to environmental safety standards
Allows for multiple configuration options with its flexible bay design
Liens connexes
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way2.5 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way2.5 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
- TE Connectivity1.8 V
- TE Connectivity 0.6mm Pitch 200 Way1.8 V
