Fischer Elektronik Heatsink, Universal Square Alu 10 mm 10 mm 10 mm

Offre groupée disponible

Sous-total (1 unité)*

1,99 €

(TVA exclue)

2,41 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Commandes ci-dessous 75,00 € coût (TVA exclue) 5,95 €.
En stock
  • 906 unité(s) prête(s) à être expédiée(s)
  • Plus 397 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
  • Plus 250 unité(s) expédiée(s) à partir du 09 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité
Prix par unité
1 - 91,99 €
10 - 241,83 €
25 - 491,74 €
50 - 991,68 €
100 +1,54 €

*Prix donné à titre indicatif

N° de stock RS:
674-4747
Référence fabricant:
ICK BGA 10x10x10
Fabricant:
Fischer Elektronik
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Fischer Elektronik

For Use With

Universal Square Alu

Product Type

Heatsink

Length

10mm

Width

10 mm

Height

10mm

Fastening

Conductive Foil

Colour

Black

Finish

Black Anodised

Compatible Package Type

PLCC, BGA, IC, PGA, Chip, LED, SMD, DIL/IC, Slot

Standards/Approvals

No

Material

Aluminium

Special Features

Other Pin Lengths and Surfaces on Request, Fan Motors Also Available With Pulse Output and Alarm Device Circuit, Suitable for Forced and Free Convection, Components Fastened Using Glue, Fan Motors With Other Operating Voltages on Request, Adhesive Foil or Clamps, High Reliability and Long Product Life, Excellent Thermal Conductivity by the Alloy Material, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Low Weight Achieved by Optimised Geometry, High-grade Industrial Type, Customer-specific Modifications and Special Designs, Low Current Consumption and Thus Low Self-Heating, Fan Motor Axle With Double Ball Bearings, Constant Heat Distribution in the Base and Pins in the Direction of Heat Flow, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry, Compact Design With High Mechanical Stability

Pays d'origine :
DE

Fischer Elektronik ICK BGA Series Heatsink


ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.

Heatsink dimensions match respective BGA-type.

Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks


Note

Adhesive is not included.

Liens connexes