Fischer Elektronik Heatsink, Universal Square Alu 10 mm 14 mm 14 mm
- N° de stock RS:
- 674-4756
- Référence fabricant:
- ICK BGA 14x14x10
- Fabricant:
- Fischer Elektronik
Sous-total (1 unité)*
1,80 €
(TVA exclue)
2,18 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
- 76 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
- Plus 325 unité(s) expédiée(s) à partir du 30 mars 2026
- Plus 500 unité(s) expédiée(s) à partir du 12 juin 2026
Unité | Prix par unité |
|---|---|
| 1 - 9 | 1,80 € |
| 10 - 24 | 1,65 € |
| 25 - 49 | 1,59 € |
| 50 - 99 | 1,54 € |
| 100 + | 1,42 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 674-4756
- Référence fabricant:
- ICK BGA 14x14x10
- Fabricant:
- Fischer Elektronik
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 14mm | |
| Width | 14 mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, BGA, DIL/IC, PLCC, Chip, IC, LED, SMD | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Special Features | Excellent Thermal Efficiency, Particularly Suited for Ball Grid Arrays, Can Be Glued Directly on BGA Component, Customer-specific Modifications and Special Designs, Effective Heat Dissipation, Compact Design, Other Pin Lengths and Surfaces on Request, Pulse Output and Alarm Device Circuit for Fans, Low Weight by Optimised Geometry, Low Current Consumption, Flow-favourable Omnidirectional Fin Geometry, Easy Mounting, High Mechanical Stability | |
| Sélectionner tout | ||
|---|---|---|
Marque Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 14mm | ||
Width 14 mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, BGA, DIL/IC, PLCC, Chip, IC, LED, SMD | ||
Standards/Approvals No | ||
Material Aluminium | ||
Special Features Excellent Thermal Efficiency, Particularly Suited for Ball Grid Arrays, Can Be Glued Directly on BGA Component, Customer-specific Modifications and Special Designs, Effective Heat Dissipation, Compact Design, Other Pin Lengths and Surfaces on Request, Pulse Output and Alarm Device Circuit for Fans, Low Weight by Optimised Geometry, Low Current Consumption, Flow-favourable Omnidirectional Fin Geometry, Easy Mounting, High Mechanical Stability | ||
- Pays d'origine :
- DE
Fischer Elektronik ICK BGA Series Heatsink
BGA Heatsinks
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