Transcend TS256GMTE672A-I M.2 (2280) 256 GB Internal SSD

Sous-total (1 unité)*

388,96 €

(TVA exclue)

470,64 €

(TVA incluse)

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  • Expédition à partir du 04 novembre 2026
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Unité
Prix par unité
1 +388,96 €

*Prix donné à titre indicatif

N° de stock RS:
174-307
Référence fabricant:
TS256GMTE672A-I
Fabricant:
Transcend
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Marque

Transcend

Memory Size

256GB

Sub Type

SSD

Product Type

SSD

Model Number

TS256GMTE672A-I

Internal/External

Internal

Form Factor

M.2 (2280)

Industrial Grade

Yes

NAND Type

3D TLC

Encryption Level

AES

Interface Type

PCIe Gen 3.0 x4 NVMe

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Length

80mm

Height

2.23mm

Standards/Approvals

BSMI, CE, FCC, RoHS, UKCA

Width

22mm

Pays d'origine :
TW

Transcend SSD, 256GB Memory Size, PCIe Gen 3.0 x4 NVMe Interface Type - TS256GMTE672A-I


This SSD is an internal non-volatile storage device designed for high-performance systems that require compact, embedded storage. It connects via a PCIe Gen3 x4 NVMe Interface in an M.2 2280 form factor and is intended for use in industrial environments where extended temperature ranges and hardware-level encryption are necessary.

Features and Benefits:


• 256GB capacity provides substantial local flash storage
• PCIe Gen3 x4 NVMe delivers low-latency data transfer
• 3D TLC NAND offers a balance of density and endurance
• AES encryption secures data at the hardware level
• Industrial-grade design tolerates -40°C to 85°C operation

Applications


• Suitable for rugged industrial control systems
• Ideal for embedded computing and edge devices
• Used with data-logging equipment in harsh conditions
• Can be used for Compact workstation storage upgrades
• Suitable for appliances requiring certified components

What physical form factor does it use?


It uses an M.2 2280 card measuring 80 mm in length and 22 mm in width with a low-profile 2.23 mm height.

Which Interface ensures compatibility with modern motherboards?


The drive interfaces over PCIe Gen3 x4 using the NVMe protocol for host connectivity.

What environmental range can it withstand?


The device is specified to operate between -40°C and 85°C to suit high-temperature deployments.

Which flash technology is implemented and why does it matter?


It uses 3D TLC NAND which provides multi-level cell storage density suitable for industrial workloads.

What regulatory approvals does it carry?


It holds BSMI, CE, FCC, RoHS and UKCA approvals.

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