Nexperia PCMF3USB3SZ 2-Element Uni-Directional ESD Protection Diode, 15-Pin WLCSP
- N° de stock RS:
- 153-1916
- Référence fabricant:
- PCMF3USB3SZ
- Fabricant:
- Nexperia
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 153-1916
- Référence fabricant:
- PCMF3USB3SZ
- Fabricant:
- Nexperia
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Nexperia | |
| Direction Type | Uni-Directional | |
| Product Type | ESD Protection Diode | |
| Diode Configuration | Complex Array | |
| Minimum Breakdown Voltage Vbr | 4.5V | |
| Mount Type | Surface | |
| Package Type | WLCSP | |
| Maximum Reverse Stand-off Voltage Vwm | 5V | |
| Pin Count | 15 | |
| Minimum Operating Temperature | -40°C | |
| Clamping Voltage VC | 6.5V | |
| Test Current It | 50mA | |
| ESD Protection | Yes | |
| Maximum Peak Pulse Current Ippm | 4A | |
| Number of Elements per Chip | 2 | |
| Maximum Operating Temperature | 85°C | |
| Width | 1.22mm | |
| Height | 380μm | |
| Length | 2.42mm | |
| Maximum Reverse Leakage Current | 100nA | |
| Sélectionner tout | ||
|---|---|---|
Marque Nexperia | ||
Direction Type Uni-Directional | ||
Product Type ESD Protection Diode | ||
Diode Configuration Complex Array | ||
Minimum Breakdown Voltage Vbr 4.5V | ||
Mount Type Surface | ||
Package Type WLCSP | ||
Maximum Reverse Stand-off Voltage Vwm 5V | ||
Pin Count 15 | ||
Minimum Operating Temperature -40°C | ||
Clamping Voltage VC 6.5V | ||
Test Current It 50mA | ||
ESD Protection Yes | ||
Maximum Peak Pulse Current Ippm 4A | ||
Number of Elements per Chip 2 | ||
Maximum Operating Temperature 85°C | ||
Width 1.22mm | ||
Height 380μm | ||
Length 2.42mm | ||
Maximum Reverse Leakage Current 100nA | ||
Common Mode filter for USB ports, No room for compromise, The most common Camera and display Interface used now for portable devices is the differential MIPI Interface running at RF frequencies. To allow operation at typical GSM/3G/LTE frequencies, a strong common-mode suppression over all bands and higher harmonics is needed. At the same time, a wide differential passband is needed to keep signal integrity. Since ESD can enter through gaps in the portable device, strong ESD protection is needed to avoid damage of the electronics or re-setting the system due to ESD strikes
Strong common-mode suppression > 14 dB in the range between 500 MHz and > 8 GHz
Wide passband > 2 GHz, ensuring signal integrity for all MIPI frequencies
ESD ruggedness > 15 kV contact, far exceeding IEC 61000-4-2 (8 kV contact)
Deep snap-back for optimized SoC protection against ESD strikes
Very thin package (0.5 mm max package height)
All LVDS signals needing a passband up to 2 GHz
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