Bergquist 1100ST Series Self-Adhesive Thermal Interface Pad, 0.012 in Thick, 1.1 W/mK, 12 in, 12in, Silicone
- N° de stock RS:
- 282-6852
- Référence fabricant:
- SIL PAD TSP 1100ST, 12in x 12in x 0.012
- Fabricant:
- Bergquist
Sous-total (1 unité)*
68,37 €
(TVA exclue)
82,73 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 04 mars 2027
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité |
|---|---|
| 1 + | 68,37 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 282-6852
- Référence fabricant:
- SIL PAD TSP 1100ST, 12in x 12in x 0.012
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.012in | |
| Thermal Conductivity | 1.1W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Width | 12in | |
| Standards/Approvals | No | |
| Length | 12in | |
| Series | 1100ST | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.012in | ||
Thermal Conductivity 1.1W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Width 12in | ||
Standards/Approvals No | ||
Length 12in | ||
Series 1100ST | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist fiberglass-reinforced thermal interface material featuring inherent tack on both sides. The material exhibits excellent thermal performance at low mounting pressures. It is supplied on two liners for exceptionally easy handling prior to auto-placement in high volume assemblies. It is ideal for placement between an electronic power device and its heat sink.
Inherent tack on both sides for exceptional thermal performance and easy placement
Re-positionable for higher utilization, ease of use and assembly error reduction
Lined on both sides for ease of handling prior to placement in high volume assemblies
Ex
Liens connexes
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