Wurth Elektronik WE-TGF Series Thermal Gap Pad, 500 μm Thick, 3 W/mK, 100 mm, 100mm, Silicone with Ceramic Particles

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7,61 €

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9,21 €

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*Prix donné à titre indicatif

N° de stock RS:
242-0150
Numéro d'article Distrelec:
302-53-096
Référence fabricant:
40113005
Fabricant:
Wurth Elektronik
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Marque

Wurth Elektronik

Product Type

Thermal Gap Pad

Thickness

500μm

Thermal Conductivity

3W/mK

Trade Name

Würth Elektronik eiSos GmbH & Co. KG

Hardness

45 Shore C

Conductive Material

Silicone with Ceramic Particles

Standards/Approvals

RoHS Approval Compliant (2011/65/EU&2015/863), REACh Approval Conform or declared ((EC) 1907/2006), Halogen Free Conform (JEDEC JS709B), Halogen Free Conform (IEC 61249-2-21)

Width

100mm

Length

100mm

Colour

Blue

Series

WE-TGF

Minimum Operating Temperature

-50°C

Maximum Operating Temperature

180°C

Wurth Elektronik WE-TGF Series Thermal Gap Pad, 3W/mk Thermal Conductivity, Blue - 40113005


This thermal gap pad provides a compliant Interface for heat transfer between components and heatsinks. It is formulated from a silicone Matrix loaded with ceramic particles to maintain thermal contact where surfaces are uneven or gap distances vary. The product operates across a wide temperature range suitable for demanding environments and is offered as a thin sheet for use in Compact assemblies.

Features and Benefits:


• 3W/mK thermal conductivity improves heat dissipation efficiency
• Silicone with ceramic particles sustains contact under vibration
• 45 Shore C hardness provides consistent compressibility control
• -50 to 180°C operating range supports extreme thermal conditions
• Halogen‑free formulation reduces risk of corrosive by‑products

Applications


• Suitable for thermal management in LED assemblies
• Used with power modules requiring tight Interface control
• Ideal for filling uneven gaps in electronic enclosures
• Can be used for component‑to‑heatsink Interfaces in Compact devices
• Suitable for industrial thermal gap filler

What material composition affects flexibility and thermal performance?


The pad is composed of a silicone carrier filled with ceramic particles, which balances pliability and conductive pathways to maintain heat transfer under mechanical stress.

How should users handle thickness constraints in tight assemblies?


The pad is supplied as a thin 0.5mm sheet enabling installation in space‑limited designs while preserving surface conformity.

What environmental specifications inform suitability for outdoor or hostile sites?


It withstands a minimum temperature of -50°C and a maximum of 180°C, allowing use across wide thermal excursions without loss of mechanical integrity.

Which standards‑related characteristics are declared for material restrictions?


The material conforms with RoHS, REACH declarations and halogen‑free criteria as per recognised test frameworks.

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