Wurth Elektronik WE-TGF Series Thermal Gap Pad, 4 mm Thick, 4 W/mK, 100 mm, 100mm, Ceramic Filled Silicone Rubber

Offre groupée disponible
Consulter les options de prix de gros

Sous-total (1 unité)*

21,08 €

(TVA exclue)

25,51 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
En stock
  • Plus 16 unité(s) expédiée(s) à partir du 11 novembre 2026
  • Plus 43 unité(s) expédiée(s) à partir du 11 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails

Unité
Prix par unité
1 - 421,08 €
5 - 919,08 €
10 +17,76 €

*Prix donné à titre indicatif

N° de stock RS:
242-0132
Numéro d'article Distrelec:
302-53-079
Référence fabricant:
40014040
Fabricant:
Wurth Elektronik
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Wurth Elektronik

Product Type

Thermal Gap Pad

Thickness

4mm

Thermal Conductivity

4W/mK

Trade Name

Würth Elektronik eiSos GmbH & Co. KG

Conductive Material

Ceramic Filled Silicone Rubber

Hardness

35 Shore C

Width

100mm

Standards/Approvals

Halogen Free Conform (JEDEC JS709B), REACh Approval Conform or declared ((EC) 1907/2006), RoHS Approval Compliant (2011/65/EU&2015/863), Halogen Free Conform (IEC 61249-2-21)

Length

100mm

Colour

Purple

Minimum Operating Temperature

-50°C

Maximum Operating Temperature

180°C

Series

WE-TGF

Wurth Elektronik WE-TGF Series Thermal Gap Pad, 4W/mk Thermal Conductivity, Purple - 40014040


This thermal gap pad is a compressible ceramic-filled silicone rubber Interface designed to conduct heat between components and heatsinks while accommodating uneven surfaces and gaps. It operates across a wide temperature range and is intended for electronic cooling applications where a conformable, electrically non-conductive filler is required. The material formulation balances softness with thermal transfer to assist in maintaining component temperatures within operational limits.

Features and Benefits:


• 4W/mK thermal conductivity for improved heat transfer performance
• 35 Shore C hardness to maintain mechanical compliance under compression
• -50 to 180°C operating range for thermal stability in varied environments
• Halogen-free formulation to meet environmental material preferences
• Ceramic-filled silicone construction for electrical isolation during heat conduction

Applications


• Suitable for bridging thermal gaps in power modules and converters
• Used for heat transfer between IC packages and chassis
• Ideal for filling uneven interfaces in LED cooling systems
• Can be used for thermal management in telecoms equipment

What are the dimensional options available for this pad?


The pad is supplied in a 100mm x 100mm format with a thickness of 4mm.

How does the material behave mechanically under compression?


The silicone rubber with 35 Shore C hardness provides compressibility to conform to surface irregularities while sustaining contact pressure.

Is the product compliant with common materials regulations?


It conforms to stated halogen-free guidelines and meets REACH and RoHS declarations as provided.

What colour identification does the pad use for assembly processes?


The pad is purple to assist Visual identification during production and maintenance.

What type of thermal filler is used to enhance conductivity?


Ceramic fillers are incorporated into the silicone Matrix to raise bulk thermal transport without introducing electrical conduction.

Liens connexes

Soyez le/la premier·ère à être informé de nos nouveautés produits et de nos offres spéciales.

adresse e-mail

Les données personnelles que vous nous fournissez en vous inscrivant à cette liste de diffusion seront traitées conformément à notre politique de confidentialité.