Vishay, 15 Outputs Synchronous Buck Regulator, 20 A Output Current
- N° de stock RS:
- 274-8642
- Référence fabricant:
- SIC931BED-Y1-GE3
- Fabricant:
- Vishay
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 plateau de 210 unités)*
2 121,84 €
(TVA exclue)
2 567,46 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 05 février 2027
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le plateau* |
|---|---|---|
| 210 - 210 | 10,104 € | 2 121,84 € |
| 420 + | 9,599 € | 2 015,79 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 274-8642
- Référence fabricant:
- SIC931BED-Y1-GE3
- Fabricant:
- Vishay
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Vishay | |
| Product Type | Synchronous Buck Regulator | |
| Output Current | 20A | |
| Number of Outputs | 15 | |
| Efficiency | 95% | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Series | SiC931 | |
| Number of Pins | 63 | |
| Package Type | PowerPAK MLP60-A6C | |
| Length | 10.6mm | |
| Standards/Approvals | RoHS | |
| Width | 6.5mm | |
| Maximum Input Voltage | 18V | |
| Minimum Input Voltage | 4.5V | |
| Sélectionner tout | ||
|---|---|---|
Marque Vishay | ||
Product Type Synchronous Buck Regulator | ||
Output Current 20A | ||
Number of Outputs 15 | ||
Efficiency 95% | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Series SiC931 | ||
Number of Pins 63 | ||
Package Type PowerPAK MLP60-A6C | ||
Length 10.6mm | ||
Standards/Approvals RoHS | ||
Width 6.5mm | ||
Maximum Input Voltage 18V | ||
Minimum Input Voltage 4.5V | ||
- Pays d'origine :
- TW
Vishay SiC931 Series Synchronous Buck Regulator, 20A Output Current, 95% Efficiency - SIC931BED-Y1-GE3
This synchronous buck regulator converts higher DC voltages into regulated lower outputs for multi-rail power systems. It is designed for compact board-level installation and supports demanding thermal environments, making it suitable for industrial and automotive contexts where multiple regulated outputs are required.
Features and Benefits:
• 95% peak conversion efficiency reduces system heat
• Operates from 4.5V to 18V input for flexible supply ranges
• Delivers 20A output current to support high-load rails
• RoHS-compliant construction supports environmental regulations
• Withstands up to 125°C for elevated temperature operation
• Provides 15 independent outputs for complex power distribution
• Operates from 4.5V to 18V input for flexible supply ranges
• Delivers 20A output current to support high-load rails
• RoHS-compliant construction supports environmental regulations
• Withstands up to 125°C for elevated temperature operation
• Provides 15 independent outputs for complex power distribution
Applications
• Suitable for vehicle control units requiring elevated temperature tolerance
• Ideal for industrial control systems with multi-rail requirements
• Used with point-of-load arrangements in telecoms equipment
• Can be used for power distribution in embedded computing platforms
• Suitable for battery-powered systems needing broad input range
• Ideal for industrial control systems with multi-rail requirements
• Used with point-of-load arrangements in telecoms equipment
• Can be used for power distribution in embedded computing platforms
• Suitable for battery-powered systems needing broad input range
How many electrical connections are available for board routing?
The module exposes 63 pins to facilitate multiple signal, power and earth/ground connections for complex layouts.
What package format assists high-density PCB placement?
It uses a PowerPAK MLP60-A6C package that supports compact solder-down mounting for space-constrained designs.
What thermal limits should PCB designers consider?
The device is specified to operate up to 125°C, so designers should plan thermal vias and adequate copper pour to manage dissipation.
What are the physical envelope considerations for enclosure design?
The component footprint measures 10.6mm by 6.5mm, enabling tight placement while allowing for standard clearance and cooling strategies.
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