CTS, S4X 47Ω ±5% Isolated Resistor Array, 2 Resistors, 0.063W total, 0402 (1005M), Convex
- N° de stock RS:
- 179-0348
- Référence fabricant:
- S41X043470JP
- Fabricant:
- CTS
Informations sur le stock actuellement non accessibles
- N° de stock RS:
- 179-0348
- Référence fabricant:
- S41X043470JP
- Fabricant:
- CTS
Spécifications
Documentation technique
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | CTS | |
| Resistance | 47Ω | |
| Number of Resistors | 2 | |
| Resistor Type | Array | |
| Package/Case | 0402 (1005M) | |
| Power Rating | 0.063W | |
| Termination Style | Convex | |
| Tolerance | ±5% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.063W | |
| Circuit Designator | ISOL | |
| Length | 1mm | |
| Depth | 1mm | |
| Height | 0.35mm | |
| Dimensions | 1 x 1 x 0.35mm | |
| Series | S4X | |
| Number of Terminals | 4 | |
| Temperature Coefficient | ±200ppm/°C | |
| Maximum Operating Temperature | +125°C | |
| Minimum Operating Temperature | -55°C | |
| Sélectionner tout | ||
|---|---|---|
Marque CTS | ||
Resistance 47Ω | ||
Number of Resistors 2 | ||
Resistor Type Array | ||
Package/Case 0402 (1005M) | ||
Power Rating 0.063W | ||
Termination Style Convex | ||
Tolerance ±5% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.063W | ||
Circuit Designator ISOL | ||
Length 1mm | ||
Depth 1mm | ||
Height 0.35mm | ||
Dimensions 1 x 1 x 0.35mm | ||
Series S4X | ||
Number of Terminals 4 | ||
Temperature Coefficient ±200ppm/°C | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
- Pays d'origine :
- JP
S4x Series Chip Arrays are designed to resist sulfurization which occurs in high-sulfur environments. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Anti-Sulfur Design Structure
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Harsh Environments
Automotive Electronics
Medical Equipment
Communications/Networking
Portable Test Equipment
Pull-Up/Pull-Down Logic Gates
Image Processing
DDR SDRAM, MDDR, DRAM
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Harsh Environments
Automotive Electronics
Medical Equipment
Communications/Networking
Portable Test Equipment
Pull-Up/Pull-Down Logic Gates
Image Processing
DDR SDRAM, MDDR, DRAM
Low Profile High Density Designs