CTS, 766 10kΩ ±2% Isolated Resistor Array, 8 Resistors, 1.8W total, SOIC, Standard SMT
- N° de stock RS:
- 179-0310
- Référence fabricant:
- 766163103GPTR7
- Fabricant:
- CTS
Informations sur le stock actuellement non accessibles
- N° de stock RS:
- 179-0310
- Référence fabricant:
- 766163103GPTR7
- Fabricant:
- CTS
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | CTS | |
| Resistance | 10kΩ | |
| Number of Resistors | 8 | |
| Resistor Type | Network | |
| Package/Case | SOIC | |
| Power Rating | 1.8W | |
| Termination Style | Standard SMT | |
| Tolerance | ±2% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.24W | |
| Circuit Designator | ISOL | |
| Length | 9.9mm | |
| Depth | 3.9mm | |
| Height | 1.75mm | |
| Dimensions | 9.9 x 3.9 x 1.75mm | |
| Number of Terminals | 16 | |
| Series | 766 | |
| Minimum Operating Temperature | -55°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Maximum Operating Temperature | +125°C | |
| Sélectionner tout | ||
|---|---|---|
Marque CTS | ||
Resistance 10kΩ | ||
Number of Resistors 8 | ||
Resistor Type Network | ||
Package/Case SOIC | ||
Power Rating 1.8W | ||
Termination Style Standard SMT | ||
Tolerance ±2% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.24W | ||
Circuit Designator ISOL | ||
Length 9.9mm | ||
Depth 3.9mm | ||
Height 1.75mm | ||
Dimensions 9.9 x 3.9 x 1.75mm | ||
Number of Terminals 16 | ||
Series 766 | ||
Minimum Operating Temperature -55°C | ||
Temperature Coefficient ±200ppm/°C | ||
Maximum Operating Temperature +125°C | ||
766 Series Resistor Networks are single packaged devices containing an array of homogeneous resistor elements. CTS network designs provide a smaller circuit footprint, excellent reliability, improved TCR tracking and resistor tolerance matching, while helping to save placement costs by reducing application component count.
Surface Mount Gull Wing Package
Solid Ceramic Construction
Narrow Body Design – 3.9mm
No Internal Dendrite Growth
Requires 30% Less Board Space Than Molded Products of the Same Power Rating
Tape and Reel Packaging or Slide Pack
Applications:
Telecom Infrastructure
Optical Networking
Wireless Networks
Edge Routers
Internet/Network Security
Storage Area Networks
Network Attached Storage
Switches
RAID Controllers
Solid Ceramic Construction
Narrow Body Design – 3.9mm
No Internal Dendrite Growth
Requires 30% Less Board Space Than Molded Products of the Same Power Rating
Tape and Reel Packaging or Slide Pack
Applications:
Telecom Infrastructure
Optical Networking
Wireless Networks
Edge Routers
Internet/Network Security
Storage Area Networks
Network Attached Storage
Switches
RAID Controllers
