Samtec ERF8 Series Vertical Surface PCB Socket, 100-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 224-7980
- Référence fabricant:
- ERF8-050-07.0-S-DV-EGP-TR
- Fabricant:
- Samtec
Offre groupée disponible
Sous-total (1 bobine de 300 unités)*
2 256,30 €
(TVA exclue)
2 730,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Informations sur le stock actuellement non accessibles
Unité | Prix par unité | la bobine* |
|---|---|---|
| 300 - 1200 | 7,521 € | 2 256,30 € |
| 1500 + | 7,28 € | 2 184,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 224-7980
- Référence fabricant:
- ERF8-050-07.0-S-DV-EGP-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 100 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Pitch | 1.27mm | |
| Current | 2.2A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Stacking Height | 18mm | |
| Connector System | Board-to-Board | |
| Voltage | 318 V | |
| Series | ERF8 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 4.5mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 100 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Pitch 1.27mm | ||
Current 2.2A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Stacking Height 18mm | ||
Connector System Board-to-Board | ||
Voltage 318 V | ||
Series ERF8 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 4.5mm | ||
Maximum Operating Temperature 125°C | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 100 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
Liens connexes
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination