Samtec ERF8 Series Vertical Surface PCB Socket, 50-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 224-7968
- Référence fabricant:
- ERF8-025-07.0-S-DV-EGP-TR
- Fabricant:
- Samtec
Offre groupée disponible
Sous-total (1 bobine de 300 unités)*
1 759,80 €
(TVA exclue)
2 129,40 €
(TVA incluse)
Ajouter 300 unités pour bénéficier d'une livraison gratuite
Temporairement en rupture de stock
- Expédition à partir du 06 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 300 - 1200 | 5,866 € | 1 759,80 € |
| 1500 + | 5,467 € | 1 640,10 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 224-7968
- Référence fabricant:
- ERF8-025-07.0-S-DV-EGP-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Sub Type | Board-to-Board | |
| Number of Rows | 2 | |
| Current | 2.2A | |
| Pitch | 1.27mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 18mm | |
| Voltage | 318 V | |
| Series | ERF8 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 4.5mm | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Beryllium Copper Alloy | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Sub Type Board-to-Board | ||
Number of Rows 2 | ||
Current 2.2A | ||
Pitch 1.27mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 18mm | ||
Voltage 318 V | ||
Series ERF8 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 4.5mm | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Material Beryllium Copper Alloy | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 50 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
Liens connexes
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination
- Samtec ERF8 Series Vertical Surface Mount PCB Socket 2-Row Solder Termination