Références fabricant

Samtec ADF6 Series Vertical Surface PCB Socket, 50-Contact, 4 Row, 0.635 mm Pitch Solder

N° de stock RS:: 202-7892
Référence fabricant:: ADF6-50-03.5-L-4-2-A
Fabricant:: Samtec

Samtec ADF6 Series Vertical Surface PCB Socket, 50-Contact, 4 Row, 0.635 mm Pitch Solder

Actuellement indisponible

Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.

N° de stock RS:: 202-7892
Référence fabricant:: ADF6-50-03.5-L-4-2-A
Fabricant:: Samtec

Spécifications

Documentation technique

Législations et de normes

Détails du produit

Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.

Sélectionner tout	Attribut	Valeur
	Marque	Samtec
	Product Type	PCB Socket
	Number of Contacts	50
	Number of Rows	4
	Sub Type	High Density Socket
	Current	1.34A
	Pitch	0.635mm
	Housing Material	Liquid Crystal Polymer
	Termination Type	Solder
	Mount Type	Surface
	Orientation	Vertical
	Connector System	Board-to-Board
	Stacking Height	5mm
	Series	ADF6
	Minimum Operating Temperature	-55°C
	Row Pitch	0.96mm
	Contact Material	Copper Alloy
	Contact Plating	Gold, Tin over Nickel
	Maximum Operating Temperature	125°C
	Standards/Approvals	CHINA RoHS, EU REACH, EU RoHS

	Sélectionner tout
	Marque Samtec
	Product Type PCB Socket
	Number of Contacts 50
	Number of Rows 4
	Sub Type High Density Socket
	Current 1.34A
	Pitch 0.635mm
	Housing Material Liquid Crystal Polymer
	Termination Type Solder
	Mount Type Surface
	Orientation Vertical
	Connector System Board-to-Board
	Stacking Height 5mm
	Series ADF6
	Minimum Operating Temperature -55°C
	Row Pitch 0.96mm
	Contact Material Copper Alloy
	Contact Plating Gold, Tin over Nickel
	Maximum Operating Temperature 125°C
	Standards/Approvals CHINA RoHS, EU REACH, EU RoHS

Datasheet - ADF6-50-03.5-L-4-2-A

Pays d'origine :: US

The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.

Incredibly dense with up to 240 total I/Os

Low profile 5 mm stack height and slim 5 mm width

4-row design; 10 - 60 positions per row (40 - 240 total positions)

Edge Rate® contact system optimized for signal integrity performance

Supports 56 Gbps PAM4 (28 Gbps NRZ) applications

Solder ball technology for simplified processing and self aligning

Additional stack heights and higher pin counts in development

Samtec ADF6 Series Vertical Surface PCB Socket, 50-Contact, 4 Row, 0.635 mm Pitch Solder

Liens connexes