Samtec ADF6 Series Vertical Surface PCB Socket, 40-Contact, 4 Row, 0.635 mm Pitch Solder
- N° de stock RS:
- 202-7890
- Référence fabricant:
- ADF6-40-03.5-L-4-2-A
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 202-7890
- Référence fabricant:
- ADF6-40-03.5-L-4-2-A
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 40 | |
| Product Type | PCB Socket | |
| Sub Type | High Density Socket | |
| Number of Rows | 4 | |
| Current | 1.34A | |
| Pitch | 0.635mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 5mm | |
| Voltage | 219V | |
| Series | ADF6 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 0.96mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Tin over Nickel, Gold | |
| Contact Material | Copper Alloy | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 40 | ||
Product Type PCB Socket | ||
Sub Type High Density Socket | ||
Number of Rows 4 | ||
Current 1.34A | ||
Pitch 0.635mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 5mm | ||
Voltage 219V | ||
Series ADF6 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 0.96mm | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Tin over Nickel, Gold | ||
Contact Material Copper Alloy | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- Pays d'origine :
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development